采用二维电感模型，计算了带接地导体的有耗互连线的频变阻抗。
Two-dimensional inductance model is applied to calculate the frequency-dependent impedance of lossy interconnect lines with ground conductor.
在大量仿真数据以及当前集成电路设计工艺的基础上，提出了一种简单互连线负载的有效电容计算模型。
A simple and efficient model was presented for computing the effective capacitance of interconnect load based on simulation and integrated circuit process.
针对高损耗衬底，基于复镜像理论，结合部分元等效电路法，建立了一种新的片上互连线物理模型。
A new physical model for on-chip interconnect on high lossy substrate is proposed based on complex image theory and PEEC.
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