The solderability of electronic solders and some factors that influence the solderability are discussed.
在熔融状态下无铅焊料合金的行为是影响电子产品微连接钎焊性的关键因素。
The solderability of electronic solders depends to a great extent on the wettability, which relates to solid, liquid and gas interfacial tensions of the melted solders on substrates.
钎料的钎焊性能很大程度取决于钎料对基板上的润湿性能，而润湿性能与液态钎料在基板上的液、固、气三相界面的界面张力有关。
Solders are the main join materials in the electronic - packaging and now lead-free solders are used in the electrical products on a large scale.
在电子封装中焊料是主要的连接材料，现在无铅焊料已经普及并大规模应用在实际电子产品中。
应用推荐