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dry etching
[draɪ ˈetʃɪŋ]

  • 干法蚀刻:一种半导体制造过程中使用的蚀刻技术,通过化学或物理方法去除材料表面的一部分,而不使用液体化学品。

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  干法刻蚀

干法刻蚀

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短语

dry etching 干蚀刻 ; [电子] 干法刻蚀 ; 干法腐蚀 ; 干腐蚀

dry etching reactor 干腐蚀反应器

dry etching apparatus 干腐蚀装置

dry etching system 干式蚀刻系统 ; 干蚀刻机 ; 干法刻蚀设备

ar ion beam dry etching ar离子束干法刻蚀

dry etching acknowledgeor 干腐蚀反响器

dry etching process 干法刻蚀 ; 干法蚀刻工艺

ICP dry etching ICP干法刻蚀

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  • 干法刻蚀 - 引用次数:1

    参考来源 - 氮化镓基LED芯片的制备研究

·2,447,543篇论文数据,部分数据来源于NoteExpress

Dry etching

  • abstract: Dry etching refers to the removal of material, typically a masked pattern of semiconductor material, by exposing the material to a bombardment of ions (usually a plasma of reactive gases such as fluorocarbons, oxygen, chlorine, boron trichloride; sometimes with addition of nitrogen, argon, helium and other gases) that dislodge portions of the material from the exposed surface. Unlike with many (but not all, see isotropic etching) of the wet chemical etchants used in wet etching, the dry etching process typically etches directionally or anisotropically.

以上来源于: WordNet

双语例句

  • The fabrication methods of MPC include electron beam lithography with subsequent evaporation and lift-off, interference lithography with dry-etching technology etc.

    制备金属光子晶体方法包括:电子束刻蚀结合后续剥离法、激光干涉光刻结合干刻蚀技术

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  • Dry etching technique of silicon is a very important process in the modern semiconductor industry.

    干法刻蚀技术现代半导体工业非常重要一项工艺

    youdao

  • Mechanism of dry etching damage and main causes for RIE induced - damage are investigated with RIE technique by utilizing PIN photodiodes.

    采用rie法利用PIN光电二极管研究干法腐蚀损伤机理引起损伤主要因素

    youdao

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