位错滑移 (Dislocation glide):低温(T/Tm<0.5)和/或高应力下,位 错沿特定滑移系(滑移面+滑移方向)滑移,位错密度不断增加,形成 位错割阶(jogs)和位错扭...
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Fluid enhances dislocation glide and climb, increases the rate of recovery of strained grains and accommodates the fracturing.
流体相促进位错滑移与攀移,并加速应变颗粒的恢复作用,以协调破裂过程。
The major deformation mechanisms were found to be dislocation glide, grain breaking, and geometric dynamic recrystallization (GDRX).
合金的变形机制主要是位错滑移,晶粒碎化和几何动态再结晶机制。
The creep mechanisms are dislocation glide at lower testing temperatures in higher stress levels and dislocation climb at higher temperatures in lower stress levels.
在研究的实验条件范围内,合金的蠕变变形机制为低温高应力下的位错粘滞滑移控制和高温低应力下的位错攀移控制;
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