Stacked Die 堆叠芯片
Multi Stacked-Die Packaging 多晶片堆叠封装
Stacked-Die Packaging 晶片堆叠封装
Stacked-Die Packages 堆栈裸片封装
double stacked molding die 双重模具
stacked die chip 叠层芯片
stacked die packaging 叠层芯片封装
stacked-die chip scale package 叠层芯片尺寸封装
This is also preformed on covered surfaces a stacked assembly : substrate - pre - form - die.
在叠层的组装工艺中,比如基板- 焊片- 芯片,即使有部分表面被盖住了,这种气氛同样有效。
The finite element analysis (FET) software ANSYS have been used to simulate the temperature and stress distribution in stacked die package under power load.
应用有限元分析软件ANSYS,模拟功率载荷下叠层芯片封装中各层的温度和应力分布。
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