...k 倒装焊器件；底充胶固化工艺；四点弯曲实验 [gap=1231]Key words: low-k flip chip device; curing process of the underfill; four-point bending test ...
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The effects of the curing process of the underfill on the vertical crack stress on top of the die, maximum equivalent stress of the low-k layer and equivalent plastic stain of the solder joint were investigated by finite element software.
通过有限元软件研究了底充胶固化工艺对芯片上方垂直开裂应力、焊点等效塑性应变及低k层最大等效应力的影响。
参考来源 - 底充胶固化工艺对低k倒装焊器件可靠性的影响·2,447,543篇论文数据，部分数据来源于NoteExpress
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