Take the powder of tin, silver and copper solder as the basis to make solder paste and simulate soldering.
以自制的锡银铜系焊粉为基础制备焊膏并做焊接模拟。
The electronic paste made of nickel, copper and aluminum nanoparticle has good performance, and it helps further minimize the circuit.
用镍、铜、铝纳米粉体制成的电子浆料性能优越，有利于线路进一步微细化。
We can use many different technologies, including copper etching, aluminum etching, conductive silver paste and so on.
同时拥有腐蚀铜、腐蚀铝、导电银浆等多种射频天线制作工艺。
应用推荐