...级进模设计_论文 关键词:接触环;级进模;整形;排样;镶件;冲模模架;技术条件;装配工艺 [gap=1774]Key words: contact chip; progressive die; plastic; nesting; Inserts; die mold; technical conditions; as..
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Also, the added schottky diode can be easily realized by schottky contact in the drain of the NMOSFET, which does not add chip area.
且该电路结构中肖特基二级管可在NMOSFET漏极直接制作肖特基金半接触来方便地实现,工艺简明可行又无须增加芯片面积。
Dust can easily lead to poor contact socket and board, in addition, some CARDS on the motherboard, the form of chip pins, and is often due to oxidation and poor contact pin.
灰尘很容易引发插槽与板卡接触不良,另外,主板上一些插卡、芯片采用插脚形式,也常会因为引脚氧化而接触不良。
Method of calculation for the non-contact IC card chip coupling power supply and the read and write distance were analyzed, and the relative low-voltage circuit designs were introduced.
分析了非接触式IC卡芯片耦台电源及读写距离的计算方法,并简要介绍了相关低压电路的设计技术。
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