Flip-Chip Ball Grid Array 翻转芯片球引出端阵列 ; 球栅阵列倒装
Flip- Chip Ball Grid Array 翻转芯片球引出端阵列
chip ball grid array 芯片球栅阵列
FC-BGA Flip-Chip Ball Grid Array 反转芯片球形栅格阵列
mid-chip solder ball 片式元件间锡珠
Chip Through Ball 身后吊传
ball grid array chip 球栅阵列芯片
Their arrogance is unbelievable, yet how many fathers play ball or chip a golf ball with their sons when out for the day on some rough land.
他们的骄傲自大,令人难以相信,但是多少父亲和儿子出去一天一起去玩球,在一些粗糙的土地上。
It can solve the problems such as inhomogeneous heating of different solder bumps in ball grid array, simultaneous heating of chip and carrier with solder ball, etc.
该方法能够很好地解决由于无铅钎料的应用引起的日益严重的诸多问题,如球栅阵列中各钎料球受热不均匀和芯片基板与钎料球同时受热等。
I wonder if I could get a chip in a ball … says Hearn.
我想知道是否我打进了一颗球…“赫恩说。”
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