Bump Interconnect Technology 突点互连技术
Studied the shock bump caused by the key stratum movement in Huafeng Colliery using the microseism locating and monitoring technology.
采用微地震定位监测技术对华丰煤矿关键层运动诱发矿震进行了研究。
This paper described the C4 fabrication of Multi-chip-modules and the MCM process, and also described the key point of MCM technology, the variety of MCM, the bump fabrication methods.
本文主要论述了MCM工艺过程及多芯片组装技术中的C4技术。并对M CM种类、MCM关键工艺、M CM凸点的制作方法等做了简单介绍。
The elastic bump according to the invention can be used for testing quality of jointing technology.
本发明的弹性凸块可以用来检测接合工艺的品质。
应用推荐