Both components-intensive, around the microstrip lines, computer motherboards and other long-term, high-end graphics board, Gigabit network equipment substrate, or to deal with demanding high-frequency, electromagnetic compatibility strict control of the board PHS, mobile phone motherboard, Wireless LAN and other wireless communications equipment, and as many as 20 layers laminated, blind hole buried the hole over the IPC board, we can provide the basis for a good model (or prototype) one-time cloning success.

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