...。用一条短线代表一对成键电子。Cl2、O2、N2和H2O分子的路构如下: 分子中用于形成共价键的电子对称为成键电子对(bonding pairs),未用于形成共价键的电子对称为孤对电子(lone pairs,nonbonding pairs or unshared pairs)。
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number of bonding electron pairs 价成键电子对数
We see three bonding pairs so this is a triple bond, indeed a multiple bond.
我们看到3对成键电子所以这是一个三重键,它确实是多重键。
Wafer pairs with bonding interface being native oxide or thermal oxide have different bonding behavior in the annealing process, which were investigated and compared.
将硅本征氧化层与硅热氧化层两种键合界面在退火过程中的行为进行了理论分析与比较。
We see three bonding pairs so this is a triple bond, indeed a multiple bond.
我们看到3对成键电子所以这是一个三重键,它确实是多重键。
Place the non-bonding pairs on peripheral atoms first, which the higher average valence electron energy.
首先将孤对电子放在外围的原子,那儿具有较高的平均价电子能。
Now if you read in the book, you read about where this figure is shown in the book, you can understand more about why these structures line up in the right way so that the right molecular elements are together to form hydrogen bonding pairs between them.
如果你预习过课本,课本中有关于这些详细的描述,你可以更深刻的理解,为什么这些结构是采用这种连接方式,以使对应的分子部分靠近,并形成氢键连接
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