The package construction, process flow, and package reliability are described, together with board level assembly processes and interconnect reliability.
论述了封装结构、工艺流程及封装可靠性，并阐述了板级组装工艺过程和互连可靠性。
With increase in electronic package density, the reliability of a board-level package under drop impact load becomes a key issue.
随着微电子封装密度的提高，板级封装在跌落冲击载荷下的可靠性成为人们关注的焦点。
The reliability of solder interconnections is dependable on the dynamic response of the board-level package.
为板级封装动态响应分析和焊料微互连应力分析提供了基础。
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