The finite element method was used for analysis of heat stress in chip on board (COB).
本文采用有限元法分析了板上芯片(COB)的热应力分布。
The finite element method was used for analysis of heat stress in chip on board(COB).
本文采用有限元法分析了板上芯片（COB）的热应力分布。
According to the release, "Super Talent achieves maximum miniaturization in the Pico series, renowned as one of the world's tiniest USB families, by using chip-on-board (COB) technology."
根据新闻稿， “超级人才达到最大的小型皮系列，被誉为是世界上最小的USB接口的家庭，通过使用芯片板（棒）技术。
应用推荐