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This paper introduces simulation methods of MCU hardware and software systems and help to solve actual problems by analyzing crystal circuit, electriferous reset and load capacity of the systems.
在单片机用户系统的设计中,必须对硬件和软件进行具体仿真。通过分析单片机系统的晶振电路、上电总清和负载能力来解决实际遇到的问题。
It deduces the formula of variation of fixed thermal capacity and elastic modulus with temperature and pressure based on the actual calculation of crystal indium.
对铟晶体作具体计算,得到了定容热容量和弹性模量随温度、压强的变化关系式。
However, the natural crystal formation of individual differences, the actual product may have a slightly different map.
但因水晶天然形成有个体差异,实际产品可能会有图中略有不同。
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