需要注意的是，上面所说的200mm规格产线计划6月15日恢复量产，此日期指的是工厂可以开始接受200mm晶圆片开始加工的日期，而从晶圆片上制出芯片并对其进行封装，制成可以直接销售给客户的成品，则可能需要再等上2.5-3个月。
The June 15 date is a wafers-in start date. It can take up to three months for a wafer to be processed and packaged for shipment to customers.
特殊规格可以根据客户的需要进行加工。
Special specification can be processed according to customer's needs.
在此基础上，对4种规格8件风道零件进行了工艺过程设计和实际加工，产品完全符合图纸要求。
On the basis of this, process planning of 8 ducts of 4 specifications are designed and machined. The products fully meet the requirements of the drawing.
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