对一种先进的双悬臂梁高量程MEMS加速度计的单芯片封装工艺进行了失效机理分析。
Failure analysis is conducted for the single chip packaging process of an advanced high-range MEMS accelerometer with double cantilever beams.
失效分析是验证测试的重要方面，它为探求芯片失效机理与优化验证测试流程奠定了基础。
Failure analysis is a main aspect of the validation test and it provides the fundamental ways for tracing the failure mechanisms and optimizing the validation test flow.
通过对多芯片组件(MCM)的结构、失效模式和机理的分析，提出了适合我国生产实际的mcm失效率预计模型。
The structure, failure model and mechanism of MCM are analyzed and the failure rate prediction model for MCM is presented.
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