实际测试结果表明：温度漂移综合补偿准确度可达0.41%，明显优于一般方法的补偿准确度。
The accuracy of compositive compensation is showed to be 0.41 % by experiment result, thus being superior to that of common method in evidence.
本文简要综述了国内外的电路温度补偿方法，对TYZ-3智能型土壤养分测试仪的温度漂移进行了试验研究。
Through the experiment with the circuits thermal drift, of TYZ-3 intelligent soil nutrition gauge, J-type field effect transistor(JFET) was found as the major cause of circuits thermal drift.
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