用X射线衍射法对表层残留奥氏体和残余应力作了定量分析。
The residual compressive stress and retained austenite were analyzed quantitatively by XRay Diffraction.
分析结果显示，在本文分析之范围内，微继电器开关之接触弯曲应力、应变以及残留应力、应变均会随著开关间隙、接触力以及电流负载之增加而增加。
The numerical results indicate that the contact stress and strain, and the residual stress and strain increase as either of the switch gap, switch contact force, or electric current loads increase.
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