如传统配方,即80 - 75%磷酸(体积比),硫酸20 - 25%,则抛光出来的光亮度不足。
If traditional formula, namely 80-75% phosphoric acid (volume compared to), sulfuric acid 20-25%, then polishes the radiance is insufficient.
若未能有效地监测抛光运作,便无法避免硅片产生抛光过度或不足的缺陷。
The most obviously of all, it needs oneefficient endpoint detection system to monitor CMP operation to avoid polishing over or not polishing completely.
应用推荐