图7所示为带状引线连接芯片和管壳装配的工艺程序。
Figure 7 shows the sequence for tape bonding the chip and assembling the package.
内引线连接是微电子器件制造过程中的重要环节之一。
Chip interconnection is an important part in the microelectronics parts manufacture process.
该光盘还包含至少一个线性天线振子，它例如经电极引线连接到转发器，并在数据区内延伸。
The optical disk further comprises at least one linear antenna element coupled to the transponder, e. g., via pole lead (s), and extending within the data region.
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