应用分子相互作用体积模型和正规溶液模型对37个二元固态合金体系的组元活度进行了拟合。
The molecular interaction volume model(MIVM) and the regular solution model have been applied to fit the activities of components in 37 binary solid alloys.
阳极键合是一种利用电和热相互作用实现固体电解质玻璃(陶瓷)与金属材料固态连接的一种新方法。
Anodic bonding is a new way to realize the bonding between solid electrolyte glasses (ceramics) and metals through the interaction process of electricity and heat.
分子相互作用体积模型在二元固态合金中的活度拟合效果优于正规溶液模型。
So the fitting effect of MIVM is better than that of the regular solution model in binary solid alloys.
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