本文利用扩展电阻技术对半导体硅、硅基材料进行测试分析,从而用以开发新材料和评估材料的质量。
We use spreading Resistance technique to test and analyze silicon and silica base materials. This technique is more suitable to control material quality and develop new materials.
本文描述了使用共面微波探针的半导体芯片在片测试技术。
We present an on-wafer measurement technique of semiconductor wafer using special coplanar microwave probes.
将微电子测试结构与质量管理理论结合起来,运用于半导体技术,取得了初步结果。
And initial results have been obtained in the field of the application of combining microelectronic test structure with quality control theory to semiconductor technology.
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