本发明通过上述材料的选择及配比、配方的优化，达到高温环境下小电流高充 电效率、长寿命的要求。
Through the choice of the materials and the optimization of ratio and formulae, the invention can meet the requirements of small current, high charging efficiency and long lifetime.
“我们现在拥有了一种高集成的中空充钠气门生产工艺，”Schaefer说，“钻孔填钠密封，一步就可以搞定。”
"We now have a high volume process for manufacturing sodium fill valves," said Schaefer. "We drill the holes, fill them with sodium and seal them all in one step."
其他性能参数传闻还包括支持高通的快充4.0以及手机前部的指纹传感器。
Other specs that have been suggested are support for Qualcomm's Quick Charge 4.0, as well as a fingerprint sensor on the front of the device.
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