公司的主要业务是集成电路封装测试和内存模块装配。
The company ' s primary business is IC component packaging and test and memory module assembly.
散热片与集成电路封装热接触用于在工作过程中提取热量。
The heat sink is in thermal contact with the integrated circuit package to extract heat during operation.
自动冲切成形系统是半导体集成电路封装引线框架后的加工专用系统。
The automatic cutting system is a special equipment for processing the lead frames of semiconductor ICs after encapsulation.
本文运用有限元方法对多热源条件下集成电路封装的热场进行了模拟和分析。
In this paper, the temperature distribution of a package with multiple heat resources was simulated and analyzed.
本发明涉集成电路封装领域，具体地说，涉及对管脚电镀时，防止置换反应的方法。
The invention involves the integrated circuit package domain, to be specific, involves when galvanizes to the base pin, prevents the permutation reaction the method.
在集成电路封装工艺过程中，对导电胶进行无氧化加热固化的质量直接决定了集成电路的质量和使用寿命。
During the integrated circuit packing process, the quality and service life of integrated circuit are decided directly by the quality of conductive adhesive through non-oxidation thermal curing.
微处理器：微型计算机的中央处理单位。封装在一枚单一集成电路薄片上。
Microprocessor: The central processing unit of a microcomputer. The microprocessor is contained on a single integrated circuit chip.
塑封集成电路因其是非气密性封装，封装材料热膨胀系数的不同以及被粘接材料表面能低，是造成塑封电路离层或开裂的内部原因。
First of all, the internal reason for the delamination or cracking is the different CTE of the packaging materials and the low surface energy of the adhesions.
CPU包含成千上万个晶体管和逻辑电路，它们被封装在一个很小的设计空间模式，称为集成电路(IC)。
The CPU contains thousands of transistors and logic circuits packaged in a very small design known as an integrated circuit (IC).
集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
集成电路技术中的一种修饰术语，表示元件体积小而且封装密度高。
In relation to an integrated circuit; a term that indicates small element size and high packing density.
集成电路倒装芯片封装中半导体铸模和载波器的焊料中的铅；
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
本文简要描述了陶瓷外壳封装集成电路自动铝丝楔焊键合的工序检查。
This paper simply described the process inspection of automation Al wire ultrasonic wedge bonding in ceramic packaging IC.
介绍了在集成电路制造封装中采用的激光微调、激光打孔、激光清洗、激光柔性布线和激光微焊技术。
Research progresses of laser trimming, laser drilling, laser cleaning, laser flexible routing and laser micro welding applied in the IC fabrication and packaging are given.
在集成电路和微波模块批量或规模生产中，无论就性能还是就成本而言，封装技术都是值得重视的关键技术。
The selection of package subtrate is also introduced, For mass production of integrated circuits and microwave modules. packaging is very critical in terms of either perform…
双列塑封的信号处理集成电路BY 139平均失效率达到10.8%，方形陶瓷封装的逻辑控制电路PC 11平均失效率达到2.5%。
The average failure rate of signal processing molectron BY139 was 10.8%. And the average failure rate of logical controlling molectron PC11 was 2.5%.
提供在电路板等上安装集成电路芯片的封装。
A package for mounting an integrated circuit chip to a circuit board or the like is provided.
随着集成电路设计复杂性以及电路工作时钟频率的不断提高，互连与封装等寄生效应对电路的影响越来越大，产生了信号完整性问题。
At very high frequencies, interconnects and packages can only be characterized by a set of sampled data from measurements or electromagnetic simulations over the frequency of interests.
集成电路引线框架、封装壳体的镀金、镀银、镀镍、镀锡工艺。
Gold, silver and nickel plating of IC lead frame and package shell.
本发明所环氧树脂组合物可以有效地用于封装各种类型的半导体器件，如晶体管、集成电路。
The epoxy resin composition can be used for effectively packaging various semiconductor devices, such as transistors and integrating circuits.
该装置由一个单杆模压塑料封装，包括一个钐钴颗粒，一极片和霍尔效应集成电路已优化的磁路。
The device consists of a single-shot molded plastic package that includes a samarium cobalt pellet, a pole piece , and a Hall effect IC that has been optimized to the magnetic circuit.
从读出集成电路结构、封装、可操作性和光电性能入手对该探测器进行了介绍。
The detector is described in terms of ROIC architecture, packaging, operability and electro-optical performances.
该研究采用超小型或小型封装的可编程器件CPLD，焊接到特制的DIP封装的托座上，形成待编程的集成电路。
The study introduced the subminiature and pint-size encapsulation CPLD, which was welded to the tailor-made seat of DIP encapsulation. , and formed the integrated circuit that pending programmed.
应用本实用新型，可以不必因为匹配另一种封装类型的集成电路而重新设计印刷电路板。
The advantage of applying the utility model is that people does not need to redesign an etched circuit card in order to match an integrated circuit of another packing type.
测系统选用进口双列封装的线性和集成电路。
Feb import dual-use monitoring system is linear and IC packaging.
测系统选用进口双列封装的线性和集成电路。
Feb import dual-use monitoring system is linear and IC packaging.
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