为形成了集成电路制造中使用的硅氧化层的方法提供。
A method for forming a silicon oxide layer for use in integrated circuit fabrication is provided.
描述一种应用于集成电路制造的超精密硅片台系统及其运动控制。
Motion control system of an ultra precision wafer stage with application to integrated circuit production was presented.
而从该厂名字“武汉新芯集成电路制造有限公司”来看，也并无中芯的陈迹。
And from this factory name "integrated circuit makes Wuhan new core limited company" in light of, the trace of the core in also be not being had.
台积公司成立于1987年，在半导体产业中首创专业集成电路制造服务模式。
TSMC created the semiconductor Dedicated IC Foundry business model when it was founded in 1987.
这些缺陷在晶体生长时出现，有这类缺陷的晶体不能用于集成电路制造，应报废。
These defects appear during crystal growth, but crystals having such defects are not considered usable for ic manufacture and are discarded .
综述了亚微米、深亚微米干法刻蚀和相关技术的最新进展及其在超大规模集成电路制造中的应用。
The latest advance of the dry etching for submicron fabrication in ULSI production and interrelated technology are introduced.
介绍了在集成电路制造封装中采用的激光微调、激光打孔、激光清洗、激光柔性布线和激光微焊技术。
Research progresses of laser trimming, laser drilling, laser cleaning, laser flexible routing and laser micro welding applied in the IC fabrication and packaging are given.
随着集成电路制造工艺的飞速发展，人们已经可以将原先用各种电路搭建的板极系统集成在一块芯片上。
With the development of semiconductor process technology, nowadays a system on a PCB (Printed Circuit Board) which is composed of several ICs can be integrated into a chip.
集成电路制造商在测试上的成本也越来越高，尤其是在建立大规模的测试版图时的时间成本与人力成本。
IC manufacturers' const testing increases to more high, especially in the establishment of a large-scale chip of the test structure of time and labor costs.
投影曝光工艺是集成电路制造过程中的关键环节，曝光系统的工艺水平已成为衡量微电子制造技术的重要标志。
Lithographic exposure is the key process in the manufacture of integrated circuit, and the performance of exposure system decides the level of microelectronic manufacture technology.
摘要：投影曝光工艺是集成电路制造过程中的关键环节，曝光系统的工艺水平已成为衡量微电子制造技术的重要标志。
Abstract: Lithographic exposure is the key process in the manufacture of integrated circuit, and the performance of exposure system decides the level of microelectronic manufacture technology.
勒布朗是一个机械师和一个集成电路制造者的儿子，他原本学习木匠手艺。他说：“我不是一个傻小子，我只是在电视上演罢了。”
Le Blanc, son of a mechanic and a circuit-board maker, originally studies carpentry. "I am not a dumb guy, " he says. "I just play one on TV".
本研究对生产实际的指导意义在于，有效的提供了一种半导体集成电路制造工艺，能够同时提供纵向NPN晶体管，纵向PN P晶体管以及横向PN P晶体管。
The significance of this article is to propose an effective semi-conductor IC manufacturing process that provides vertical NPN, vertical PNP and lateral PNP transistors.
一些公司也在用类似的方法制造处理器和不同型号的集成电路。
It USES similar methods to those employed to manufacture processors and other types of integrated circuits.
他相信，制造SQUID时，这项技术的应用比现代的印刷集成电路技术要容易，因为它不需要有光敏涂层，也不再需要化学物质洗去涂层。
He believes this would be easier to carry out than the lithography currently used to manufacture SQUIDs because it would require no photosensitive mask and no chemicals to wash away that mask.
制造集成电路需要将如半导体和金属等多层材料放置在硅片上。
Making integrated circuits involves depositing layers of materials such as semiconductors and metals on a silicon wafer.
在冲向这堵墙的过程中，为了保持速度，通过把集成电路堆叠起来增加密度，闪存业已开始制造三维芯片。
To keep up speed on the way to the wall, the industry has begun building three-dimensionalchips by stacking circuits on topof one another to increase densities.
当电子设备制造商希望能更小的设备里实现更快的计算能力和更大的内存时，层叠式集成电路的发展前景越来越有活力。
They're vital as consumer electronics makers look to cram more processing power and memory into smaller devices.
为了制造分立器件和集成电路，我们使用许多不同种类的薄膜。
To fabricate discrete devices and integrated circuits we use many different kinds of thin film.
Acme代表了零件方面的主要制造商，例如电子和硬件、电桥和二极管、电容器、连接器、感应器、LED显示器、集成电路和电阻器。
Acme represents major manufacturers in parts, such as batteries and hardware, Bridges and diodes, capacitors, connectors, inductors, LED displays, integrated circuits, and resistors.
由于CMOS集成电路中的故障和制造缺陷是多种多样的，其中有些故障既不能被电压测试也不能被稳态电流测试方法检测出来。
Due to the diversity of the faults and manufacturing defects in CMOS IC, some of the faults can neither be defected by voltage test nor by IDDQ test.
方形光二极管阵列包括四个集成在通用磷化铟（InP）衬底上的光二极管单片集成电路，采用低制造、集成与测试率的铟镓砷化物/磷化铟半导体工艺制造。
The Quad PD Arrays consist of four photodiodes monolithically integrated on a common indium phosphide (InP) substrate, and are fabricated using a low FIT rate InGaAs/InP semiconductor process.
当代超大规模集成电路设计与制造技术日趋成熟。
Now, the design and manufacture technology of VLSI have been perfected.
数字逻辑门电路作为集成电路被制造：所有组成的晶体管和电阻建立在一块半导体材料上。
Digital logic gate circuits are manufactured as integrated circuits: all the constituent transistors and resistors built on a single piece of semiconductor material.
绝缘层上硅硅片用于制造集成电路具有高速、低功耗、集成度高等优势。
SOI (Silicon on Insulator) used for integrated circuit (IC) manufacturing has two advantages of increasing speed and reducing power consumption.
利用TCAD方法已成为集成电路和分立器件设计和制造的重要方法。
The TCAD approach has become one of the most important methods in design and manufacture of silicon integrated circuits and discrete devices.
光刻校正技术已成为超深亚微米下集成电路设计和制造中关键的技术。
The optical lithography correction techniques become key technologies in the IC designing and manufacturing of VDSM.
对用于甚大规模集成电路(ULSI)制造的关键平坦化工艺———铜化学机械抛光(CMP)技术进行了讨论。
The copper chemical-mechanical polishing (CMP) which is the key planarization technology for ULSI manufacturing was discussed.
对用于甚大规模集成电路(ULSI)制造的关键平坦化工艺———铜化学机械抛光(CMP)技术进行了讨论。
The copper chemical-mechanical polishing (CMP) which is the key planarization technology for ULSI manufacturing was discussed.
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