三维微电子学主要研究三维集成电路的设计与制造。
Three-dimensional microelectronics focuses on the design and fabrication technology for 3-d integrated circuits.
本发明属于微电子学与固体电子学领域的超大规模集成电路设计，是一种采用电感实现的射频信号集成静电释放保护电路。
The invention belongs to SLSI design of field of microelectronics and solid electronics; it is a radio-frequency signal integration static release protecting circuit realized by inductance.
本发明属于微电子学与固体电子学领域的超大规模集成电路设计，是一种采用电感实现的射频信号集成静电释放保护电路。
The invention belongs to SLSI design of field of microelectronics and solid electronics; it is a radio-frequency signal integration static release protecting circuit realized by inductance.
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