铅及其化合物可使用于电池油漆陶瓷铅锡焊接及汽油的添加剂上。
Lead and its compounds may be found in products such as batteries, lead - based paints, lead - containing ceramics, lead solder and leaded petrol.
的确，锡已经取代了在焊接时会产生大量有害物质的铅的王者之位。 由于锡毒性较弱，它已在许多焊接过程中取代了铅。
Tin has replaced lead, which is more toxic, in a lot of soldering.
此单元组还包括操作预先组合好的生产焊接，钎焊和锡焊设备的机器操作员。
This unit group also includes machine operators who operate previously set up production welding, brazing and soldering equipment.
将电路板放置在焊台上，针对需要焊接的通孔元件管腿，选择合适的喷锡口，启动波峰焊接。
The circuit board is placed in the welding stage, the pins through hole components welding, choose appropriate spray tin, soldering start.
也可以是根据焊接的对象大小，设计成不同规格的喷锡口。
Also can be according to the welding object size, designed to different specifications of the mouth spray tin.
据实际情况采用锡或氩焊接。
同锡线一起使用，焊接不锈钢等难以上锡的金属。
Used with the solder wire together, soldering a stainless steel etc metal.
高级精密焊接纯锡铅合金材料制品。
High precision welding materials pure tin lead alloy products.
适用于铜材的焊接，例如铜和锡铜合金，尤其是用于铜锌合金和钢的连接焊。
Suitable for welding of copper materials, for example copper and tin bronzes , especially used for joining of copper zinc alloys and steels.
提出一种制作铜-康铜热电偶的新方法：锡膜焊接法。
Tinfoil welding technique was employed to make copper-constantan thermocouples.
以自制的锡银铜系焊粉为基础制备焊膏并做焊接模拟。
Take the powder of tin, silver and copper solder as the basis to make solder paste and simulate soldering.
本文结合公司的生产实际，对无铅锡膏和无铅焊接工艺进行了系统研究。
This paper's actual production of lead-free solder paste and lead-free soldering process has been systematically studied.
MIG填丝焊接过程中，随着填入锡黄铜焊丝速度的加快，锌元素的过渡系数有减小的趋势。
In the MIG with filler wire. With the increase of wire feed speed, transition coefficient of Zn trend to decrease.
焊接时产生的锡珠少，减少短路现象的发生。
Very few Soldering Balls occur and cut down the short circuit.
锡磷青铜，耐蚀、强度高。铜、硅青铜及黄铜焊接用。
Tin phosphor bronze, corrosion resistance and high strength. Welding of copper, silicon bronze and brass.
焊接机器人、BGA返修台、自动点胶机、视频显微镜、吸烟系统、焊台、锡炉、超声波清洗器。网络测试工具等。
Solder Robert, BGA rework station, Automatic Glue dispenser, Video Microscope, Fume absorber, Soldering station, Solder pot, Ultrasonic cleaner, Cable tester, etc.
使用X-RAY射线检测了无铅锡膏的焊接空洞问题，发现焊接空洞的大小和直径都在可以接受范围内。
X-RAY-ray inspection using a lead-free solder paste of voids issue, found that the size and diameter welded hollow in acceptable range.
统计分析了焊接缺陷主要是表现为锡球断路、焊锡过流、锡球分布不对称以及烧焦和锡溅，主要受锡球大小、焊盘相对位置以及有关加工参数的影响。
By statistical analysis, the defects are tin-ball short, overflowing, dissymmetry, splash and scorch, which are mainly affected by the tin-ball size, pad positions, and process parameters .
介绍硬盘磁头激光锡球焊接的原理和优点；
Introduces the principle of the tin-ball laser bonding on hard disk sliders and its merit.
怀疑吸嘴在吸取芯片的时候存在偏差，然后在焊接的时候真空漏气，最终导致了锡料被吸到芯片表面。
I suspect there is a deviation in the draw nozzle chip time, and then when welding vacuum leak, resulting in a tin material is attracted...
量测点以高温锡丝焊接。
目前，纯锡镀层的焊接可靠性差，锡基二元合金镀层有脆性大、润湿性差等方面的问题，贵金属镀层成本高。
At present, pure tin deposit has a bad solder reliability, tin-based binary alloy deposits have big brittleness or bad wettability, and noble metal deposits have high price.
能轻松刺破焊接锡球的氧化，接触稳定，而又不会损坏锡球。
Welding can be easily shattered the tin-oxide layer, contact stability, which does not damage solder ball;
锡焊点的连接力要小于钎焊、铆接或焊接的连接点。
The strength of soldered joint is less than a joint which is brazed, riveted or welded.
文章通过试验证明：纯锡焊料凸块和含钴底部凸块金属焊层结合可延长无铅焊接倒装片的寿命。
In the article experiment prove:combination with feine tin-solder-bumps and underbump-metalliza with cobalt be able to longthen life of leadless flip-chip-solderng.
该工艺打破了娄似接头采用传统的铺锡钎焊方法，大大降低了工艺程难度、制造成本，缩短了生产周期、提高焊接接头的强度。
This process is joint Lou broke traditional tin soldering shop, greatly reduce the cost of manufacture process, the difficulty, shorten the production cycle, and improve the welding joint intensity.
锡炉表面光泽如镜，且液相体较佳，焊接性能更好，减低浪费。
Solder has highly reflective surface and low viscosity, for improved soldering and reduced waste.
纯锡焊料凸块和含钴底部凸块金属焊层结合可延长无铅焊接倒装片的寿命。
The cost of wire bonding chips and solder bumped flip chips on boards or on organic substrates is stated.
本发明的有益效果是：本发明一种焊锡喷锡装置的锡面平等均匀、可提升焊接良率。
The soldering tin jet device according to the invention has the advantage that: the tin surface is level and uniform and soldering yield can be enhanced.
本发明的有益效果是：本发明一种焊锡喷锡装置的锡面平等均匀、可提升焊接良率。
The soldering tin jet device according to the invention has the advantage that: the tin surface is level and uniform and soldering yield can be enhanced.
应用推荐