圆片级芯片尺寸封装（WL-CSP）工艺是在固态芯片尺寸玻璃外壳中装入芯片。
This wafer level chip size package (WL-CSP) process encases the die in a solid die-size glass shell.
该形状可与外壳内的部件一致，例如PCB、扬声器、麦克风、芯片部件、IC等。
The shape may conform to the components inside the housing such as the PCB, speakers, microphones, chip components, IC's or the like.
该形状可与外壳内的部件一致，例如PCB、扬声器、麦克风、芯片部件、IC等。
The shape may conform to the components inside the housing such as the PCB, speakers, microphones, chip components, IC's or the like.
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