介绍了MCM-C的CAD设计方法，以及MCM-C基板的制作与金属化、芯片的测试和老化、芯片互连等工艺。
This paper describes the CAD method for MCM-C, the fabrication and metallization processes of MCM-C substrates, and the technologies for die test, burn-in and interconnection.
介绍了MCM-C的CAD设计方法，以及MCM-C基板的制作与金属化、芯片的测试和老化、芯片互连等工艺。
This paper describes the CAD method for MCM-C, the fabrication and metallization processes of MCM-C substrates, and the technologies for die test, burn-in and interconnection.
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