通常,显微机械加工的部件和电子电路是分开制造的,然后在同一封装块内用线将它们连在一起。
More often, the micromachined part and electronics are fabricated separately and then wire bonded together in a single package.
通常,显微机械加工的部件和电子电路是分开制造的,然后在同一封装块内用线将它们连在一起。
More often, the micromachined part and electronics are fabricated separately and then wire bonded together in a single package.
应用推荐