本文采用一种新的数字图像相关方法测量带有半导体电热膜的远红外陶瓷热胀系数。
A new digital image correlation method (DICM) measurement is utilized to investigate the thermal expansion coefficient of the far-infrared ceramic coated the semiconductor galvanothermy membrane.
晶化处理温度对因热胀系数差异带来的热拉应力因马氏体相变而致的相变压应力均有不同程度的影响。
And the influence of annealing temperature was also found to be caused by the expansion coefficient difference and martensitic transition.
介绍了微波多层板所用基材的性能参数，重点阐述了材料的介电常数、介质损耗、热胀系数、特性阻抗对多层板性能的影响。
The effect of dielectric constant, dielectric loss factor, coefficient of thermal expansion (CTE)and characteristic impedance of substrate materials on properties of MMB are mainly discussed.
在施工过程中，因为PC板材刚度强、热胀冷缩的系数大，因此对比简略设备。
In construction process, because the PC sheet strong rigidity, heat bilges cold shrink coefficient is big, so the contrast brief equipment.
组织结构均匀，热胀冷缩系数小。
Theganizational structure is even the expansion shrinkage coefficients are small.
组织结构均匀，热胀冷缩系数小。
The organizational structure is even and the expansion and shrinkage coefficients are small.
温度收缩系数是反映材料热胀冷缩特性的参数，贫砼基层材料的温缩特性又直接影响到温度应力。
Temperature contraction coefficient is a parameter for material expansion and contract property when temperature becomes high ot low.
温度收缩系数是反映材料热胀冷缩特性的参数，贫砼基层材料的温缩特性又直接影响到温度应力。
Temperature contraction coefficient is a parameter for material expansion and contract property when temperature becomes high ot low.
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