溅射总需求也会趋于减少资本需求。
Sputtering overall demand tends to reduce demand for capital, too.
溅射压强增加，透光率略有升高。
With increasing sputtering pressure, the transmittance increases.
随着溅射时间的延长，薄膜厚度增加。
When the sputtering time prolongs, the films become thicker.
溅射靶材、物理气相沉积、高温合金。
Uses: sputtering target, physical vapor deposition, high temperature alloys.
人们认为溅射的声音可以驱赶邪恶的灵魂。
People thought the spluttering sound could help to drive away evil spirits.
介绍一种大功率直流溅射恒流电源的设计。
所有样品采用射频辅助磁控溅射方法制备。
All samples were prepared by rf magnetron sputtering method.
本文介绍了等离子增强磁控溅射沉积技术。
This article presents an introduction to Plasma enhanced, magnetron sputtered deposition Technology.
爆炸溅射范围增加(范围内被炸造成100%伤害)。
Increased splash range (100% damage taken throughout range).
磁控溅射已经成为沉积薄膜的最重要的方法之一。
Magnetron sputtering has become one of the most important methods for depositing thin films.
同位素角效应是一次溅射效应，还是二次溅射效应？
Is the isotope angular effect the primary or the secondary sputter effect?
应用TRIM程序模拟了离子在氚钛靶上的溅射产额。
Ion sputtering yields on t? Ti target are numerically calculated with TRIM program.
该电源为磁控溅射镀膜设备实现自动控制提供了方便。
The power supply will be convenient for controlling the magnetron sputtering coater automatically.
从理论上分析了平面磁控溅射靶沉积薄膜的厚度均匀性。
The thickness uniformity of films deposited by planar magnetron sputtering target was analyzed theoretically.
计算的溅射产额和反向散射系数同实验结果进行了比较。
The results of the calculation have been compared with those of the experiment.
其结果表明：在较低溅射功率密度下，薄膜为无定型结构；
The results show that the thin films, prepared by low rf power, are amorphous.
该电路应用于溅射镀膜机上，可较精确地控制多层合金膜镀层。
It has been applied in sputtering coater system to obtain multi-layer alloy film accurately.
结果表明，溅射工艺因素对薄膜的成份和磁性能有较大的影响。
The results show that the sputtering process factors have large effect on the compositions and magnetic properties.
实验结果表明，液体的溅射速度和距离随着背景气压的降低而增加。
The experimental results show that, liquid sputtering velocity and distance increase with the decrease of the ambient pressure.
本文从工厂应用的角度着重讨论磁控溅射镀膜机镀氮化钛装饰膜的工艺问题。
With the view of the application in factory, the process of tin decorative coating coated by magnetron sputtering coater is emphatically discussed in this paper.
真空溅射镀膜技术及设备在当今和未来都拥有十分广阔的应用领域和发展前景。
The technology and equipment of the vacuum sputtering coating have the extremely broad application and the development in the future.
当入射原子的能量大于溅射阈值时，溅射产额随入射原子能量的增加而线性增大；
When the incident energy is higher than the threshold energy, however, the sputtering yield increases with the increase of the incident energy.
光学信息记录介质用银合金反射膜，为此的银合金溅射靶，以及光学信息记录介质。
Silver alloy reflective films for optical information recording media, silver alloy sputtering targets therefor, and optical information recording media.
与普通溅射方法相比，本设备的优点是：溅射电压大大降低，而淀积速率提高很多。
Comparing with general sputtering method, this equipment has the advantages of decreasing the sputtering voltage and increasing the rate of deposition obviously.
气体离化团束的高溅射产额可能是由于多体碰撞、侧向溅射及高能量密度的照射引起的。
The higher sputtering yield would result from multiple collision, lateral sputtering and high density energy deposition of gas cluster ion beam.
而主导二次离子溅射的过程是动能溅射，它与靶表面的动量沉积(核能损)过程密切相关。
However, the predominant process of secondary ion sputtering is kinetic sputtering, which closely related to the momentum deposition on the target surface (nuclear stopping power).
研究了溅射条件对钽硅薄膜电性能的影响以及溅射电压、溅射电流和溅射气压之间的关系。
The effect of sputtering conditions on electrical properties of the tantalum-silicon films and the relation between sputtering voltage, current and pressure was investigated.
研究了溅射条件对钽硅薄膜电性能的影响以及溅射电压、溅射电流和溅射气压之间的关系。
The effect of sputtering conditions on electrical properties of the tantalum-silicon films and the relation between sputtering voltage, current and pressure was investigated.
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