研究了在铜合金表面电镀纯铜层保护膜对铜合金引线框架氧化失效的影响。
The effects of surface electroplate pure copper on oxidation failure of lead frame copper alloys for IC package were investigated.
本文对晶体二极管引线光亮电镀锡的可焊性进行了研究。
This article conducts a research on the weldability of crystal diode lead wire luminous electrotinning.
引线框架电镀层的质量直接影响着钽电容器的可焊性，所以引线框架电镀层质量的测定方法至关重要。
The Quality of lead frame plating layer directly affects the solderability of tantalum capacitor, so its measuring methods are very important.
吸热和封装数据，衬垫间距，裂口，长度，宽度，伸展，镊子除去，缺少的，断掉的，未电镀引线。
Heat - sink and Package datum , Pad Spacing, Gap , Length, Width, Spread, Tweeze , Missing, Broken or Un - plated Pad.
通过电镀可以经济快速地获得较厚的引线铜膜，使得引线电阻远小于热敏元件阻值，有利于减小引线的热敏干扰。
Electroplating can realize economically higher thickness of the lead film than does sputtering to keep the lead resistance small and minimize its influence on thermal sensing.
通过电镀可以经济快速地获得较厚的引线铜膜，使得引线电阻远小于热敏元件阻值，有利于减小引线的热敏干扰。
Electroplating can realize economically higher thickness of the lead film than does sputtering to keep the lead resistance small and minimize its influence on thermal sensing.
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