光刻-从掩膜到圆片转移的过程。
Lithography % - The process used to transfer patterns onto wafers.
SD补片由两片被轴连接的圆片组成。
The SD patch is composed of two discs connected by a thick shaft.
划伤-晶圆片表面上的小皱造成的缺陷。
Slip - A defect pattern of small ridges found on the surface of the wafer.
凹槽-晶圆片边缘上用于晶向定位的小凹槽。
Notch hAn indent on the edge of a wafer used for orientation purposes.
黄瓜被切成了圆片。
测试晶圆片駦-用于生产中监测和测试的晶圆片。
Test wafer - a silicon wafer that is used in manufacturing for monitoring and testing purposes.
加工测试晶圆片䏐-用于区域清洁过程中的晶圆片。
Processs Test wafer - a wafer that can be used for processes as well as area cleanliness.
耗尽层-晶圆片上的电场区域，此区域排除载流子。
Depletion Layer - a region on a wafer that contains an electrical field that sweeps out charge carriers.
表面形貌剂-一种用来测量晶圆片表面形貌的工具。
Profilometer - a tool that is used for measuring surface topography.
它们可以分为圆片级封装、芯片级封装、和封装面。
They can be classified into wafer level, chip level, and package level stacking.
因为一张肖像画要放几千个圆片，因此这部分特别难。
That's the difficult part, because there can be several thousands circles in a single portrait.
我总是沿着人物的主线条和特别的表现力来放置圆片。
I try to place them with harmony, according to the main lines and energy of the person represented.
蚀刻-通过化学反应或物理方法去除晶圆片的多余物质。
Etch - a process of chemical reactions or physical removal to rid the wafer of excess materials.
质量保证区（FQA）-晶圆片表面中央的大部分。
Fixed Quality Area (FQA) - The area that is most central on a wafer surface.
扫描电镜图显示该圆片由局部规则排列的碳纳米管构成；
Scanning electron microscope pictures showed that the pellet consisted of highly aligned nanotubes.
研究人员目前正在扩展他们的工作，将单层石墨烯迁移到硅晶圆片上。
The researchers are now extending their work to single graphene sheets that have been transferred onto silicon wafers.
底部硅层ꢃ-在绝缘层下部的晶圆片，是顶部硅层的基础。
Base silicon layer - the silicon wafer that is located underneath the insulator layer, which supports the silicon film on top of the wafer.
总计指示剂数(ir)-晶圆片表面位面间的最短距离。
Total Indicator Reading (TIR) - the smallest distance between planes on the surface of the wafer.
原始测试晶圆片㠰-还没有用于生产或其他流程中的晶圆片。
Virgin test wafer - a wafer that has not been used in manufacturing or other processes.
晶圆片搀杂剂可以在元素周期表的III和V族元素中发现。
Dopants for silicon wafers are found in Groups III and V of the Periodic Table of the Elements.
雾度-晶圆片表面大量的缺陷，常常表现为晶圆片表面呈雾状。
Haze - a mass concentration of surface imperfections, often giving a hazy appearance to the wafer.
已经设计出专门的探头来测量半导体晶圆片和半导体棒的电阻率。
Special probes have been designed for making resistivity measurements on semiconductor wafers and bars.
弗吉尼亚大学的测试表明，这种圆片可以制造出干净安全的用水。
Testing at the University of Virginia shows that the disc produces clean, safe water.
表面起伏ꊝ-在合适的光线下通过肉眼可以发现的晶圆片表面凹陷。
Dimple eA concave depression found on the surface of a wafer that is visible to the eye under the correct lighting conditions.
对于具体应用该晶圆片有严格的要求，但是要比主晶圆片要求宽松些。
This wafer has very strict specifications for a specific usage, but looser specifications than the prime wafer.
介绍了圆片级可靠性技术产生的背景，对其特点和作用作了详细的论述。
This paper introduces the background of using Wafer Level Reliability technology, and expounds the characteristics and functions in details.
介绍了在单层陶瓷圆片的基础上实现单层陶瓷圆片带引线元件的片式化。
It was introduced how to change single layer ceramic disc components with leads into chip components on the basis of single layer ceramic discs.
介绍了三种典型的圆片键合强度表现形式：抗拉强度、剪切强度和粘接强度。
Three typical manifestations of wafer bonding strength were introduced as tensile strength, shear strength and adhesive strength.
探讨了使用湿化学法对硅片表面进行活化，完成硅圆片低温直接键合的流程。
The process of low temperature wafer direct bonding using wet chemical surface activation methods are discussed.
本文对圆片级封装的定义、演变、进展状况及支撑技术进行了介绍和分析评论。
The difination, evolution, status and supporting technologies of wafer-level packaging are introduced and reviewed in this paper.
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