实验研究了二维圆射流阵列冲击肋粗糙表面换热。
Impingement heat transfer from the rib roughened surface within 2 dimensional arrays of circular jet has been experimentally investigated.
同时，研究了岩石渗透率对旋转射流和普通圆射流影响的区别。
Meanwhile the distinction of the effects of rock permeability on swirling jet and straight jet is studied.
利用超声多普勒流速仪（ADV）对反向流动中圆射流流动特性进行了试验。
The flowing characteristics of a round turbulent jet in counter flowing ambientce are studied by using Acoustic Doppler Velocimeter (ADV) measurement techniques.
实验发现，星形喷嘴射流与普通圆射流相比，其射流初始段较短，但基本段内速度随喷距衰减的速率较低。
It is found that the star_shaped nozzle jet has a shorter initial section and slower velocity attenuation along the jet centerline in the main region than the round nozzle jet.
在冷喷涂材料表面改性技术研究中，圆喷嘴气、固两相可压缩紊流射流的流场计算非常重要。
In the cold gas dynamic supersonic powder spraying technology for material modification, the two phase turbulent numerical computation of the jet field is very important.
采用相多普勒颗粒分析仪(PDPA)测量了雷诺数为8500的两相圆湍射流速度场，研究了两种大粒径颗粒对湍流的调制作用。
Two-phase velocity fields in a round turbulent jet with Reynolds number 8500 were measured by phase Doppler Particle Analyzer (PDPA).
本文首次利用数值模拟的方法对喷流换热中一组圆喷嘴射流的流动特性进行了研究，得出了有用的结论并进行了实验验证。
The flowing characteristics of jet through array of round nozzle in impingment heat transfer was investigated by numerical simulation.
论文成功研制了气固两相圆湍射流拟序结构实验台及其流动显示系统。
The gas-particle round jet coherent structure experimental system and the visualization system were successfully designed and manufactured.
分析了不加扰动和加扰动模拟的本质差异，指出准确预报实际圆湍射流流动应采用施加入口扰动的三维模拟。
The results show that the actual turbulent round jet flow must be simulated by a three-dimensional analysis with inlet perturbations.
为了探求气固两相圆湍流射流的特性，研究了不同雷诺数对气固两相圆湍射流的影响。
To study the characteristics of the gas-particle turbulent round jet, the effects of Reynolds number on the round jet were investigated.
通过采用流动显示、PDA、PIV 等多种先进测试手段从定性到定量，从单点时均到全场瞬时，从多个角度深入探讨了两相圆湍射流中近喷口区域颗粒相对气相调制规律的物理机制。
The physical mechanism of the modulation law from the particle-phase to the gas-phase was discussed from several points of view by means of flow visualization, PDA and PIV measurement.
通过对半导体加工工艺的分析研究，提出了用磨料水射流切割半导体材料，包括晶圆的切割、芯片的终端封装切割。
After an analysis of the process of semiconductor fabrication, a proposal of the wafer dicing using micro-abrasive waterjet is put forward.
通过对半导体加工工艺的分析研究，提出了用磨料水射流切割半导体材料，包括晶圆的切割、芯片的终端封装切割。
After an analysis of the process of semiconductor fabrication, a proposal of the wafer dicing using micro-abrasive waterjet is put forward.
应用推荐