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提高温度有利于出现内聚破坏,而提高实验速度则易于出现界面破坏。
It prefers cohesive failure at high temperature, otherwise it tend to interface failure at high loading rate.
youdao
-
提高温度有利于出现内聚破坏,而提高实验速度则易于出现界面破坏。
It prefers cohesive failure at high temperature, otherwise it tend to interface failure at high loading rate.
youdao