该中间元件包括至少一个介电层。
The intermediate member includes at least one dielectric layer.
第一介电层覆盖成对的维持电极。
A first dielectric layer covers the pairs of sustain electrodes.
在第一介电层上沉积第一电极层。
A first electrode layer is deposited over the first dielectric layer.
可编程通孔器件包括第一介电层；
The programmable via device comprises a first dielectric layer;
焊罩层配置在介电层上且覆盖线路层。
The solder mask is configured on the dielectric layer and covers the circuit layer.
第二介电层覆盖寻址电极。
而介电层是在固态电解质层与金属层之间。
The dielectric layer is arranged between the solid state electrolyte layer and the metal layer.
线路层接触介电层，且线路层具有至少一接垫。
The circuit layer is contacted with the dielectric layer and is provided at least one gasket joint.
本文介绍了介电层厚度控制的意义及控制方法。
The paper introduces meaning of control and method of control about the medium thickness.
所述介电层包含多个开口，形成于该散热薄层上。
The dielectric layer comprises a plurality of openings which are formed on the heat dissipation thin layer.
将半导体氧化层与金属氧化物层转化成一第一介电层。
The germanium oxide layer and the metal oxide layer are converted into a first dielectric layer.
下导电栓与设置于下层间介电层上的相变材料图案接触。
The lower conductive plug is in contact with a phase change material pattern disposed on the lower interlayer dielectric layer.
可在包括读出电路的第一衬底上方形成布线和层间介电层。
A wiring and interlayer dielectric layer may be formed over the first substrate including the readout circuit.
一种电路板，其包括介电层、线路层、至少一导电接合柱与焊罩层。
The circuit board comprises a dielectric layer, a circuit layer and at least one electricity-conducting joint pole and a solder mask.
所述介电层和间隔壁由两种互补色着色，基本上滤除了几乎所有的光。
The dielectric layer and the barrier ribs are colored with two complementary colors that essentially filter out nearly all light.
介电层仅包覆于导电凸块的周围表面或更包覆于基材的部分表面上。
The dielectric layer only covers the peripheral surface of the conductive bump or the partial surface of the substrate.
一第一层间导电接孔形成于且穿过一层间介电层以及一介电蚀刻停止层。
A first interlayer conductive joint hole is formed on and through an interlayer dielectric layer and a dielectric etch stop layer.
第一介电层覆盖公共电极及扫描电极，并且包括凹槽形状的场集中单元。
A first dielectric layer covers the common electrodes and the scanning electrodes, and it includes groove shaped field concentration units.
在本论文中，吾人将探讨数种高介电系数介电层与金属闸极的研究与应用。
In this dissertation, we will investigate the application of several high-k dielectric and metal gate process technologies.
中间元件可以包括多个介电层，这些介电层的边缘部分具有各不相同的宽度。
The intermediate member may include a plurality of dielectric layers, the edge parts of which have widths different from each other.
该第二层间导电接孔形成于且穿过该层间介电层，且与该第二平板电极相接触。
A second interlayer conductive joint hole is formed on and through the interlayer dielectric layer and is contacted with the second plate electrode.
本方法避免在介电层的侧壁以及介电层之间产生多晶硅残留，防止漏电流发生。
The method can avoid multicrystal silicon residue between the sidewall of the dielectric layer and the dielectric layer, thereby preventing leakage current.
因此可通过降低电极之间的介电层厚度，同时增加储存电容的电容率以及像素的开口率。
It can reduce the thickness of the dielectric layer between the electrodes and synchronously increases capacitivity of storage capacitance and aperture ratio of pixel.
本论文中，我们尝试使用一氧化二氮电浆氮化处理，以改善二氧化铪闸极介电层的品质。
In this thesis, we try to use post-deposition N2O plasma nitridation to improve the HfO2 film quality.
通过将多孔介电层经中间的增粘介电层粘合到基本上无孔的贴面层上来制备本发明的结构。
The structures of the invention are prepared by adhering a porous dielectric layer to a substantially nonporous capping layer via an intermediate adhesion promoting dielectric layer.
电容传感器是基于平板电容模型的一种新型传感器，其电容值取决于介电层厚度和介电常数。
The capacitance of the sensor is depended on the thickness and dielectric behavior of its dielectric layer.
半导体装置包括从基底突出的隔离层、分隔件、隧道绝缘层、浮置栅极、介电层图案和控制栅极。
The semiconductor device includes a isolated layer protruding from a substrate, a separator, a tunnel insulation layer, a floating grid, a dielectric layer pattern and a control grid.
该防焊层形成于该可挠性介电层上，以局部覆盖该些引脚，并依不同应用可覆盖或显露该补强金属图案。
The solder mask layer is formed on the flexible dielectric layer to locally cover the pins and to cover or expose the reinforced metal patterns according to different application.
一种改善变形的半导体封装基板，主要包括一可挠性介电层、多数个引脚、至少一补强金属图案以及一防焊层。
A semiconductor package substrate for preventing deformation mainly comprises a flexible dielectric layer, a plurality of pins, at least one reinforced metal pattern and a solder mask layer.
本发明公开了制造图像传感器的方法，该方法包括以下步骤：在其中形成有光电二极管的衬底上方形成层间介电层；
The invention discloses a method for manufacturing an image sensor. The method comprises following steps: forming an interlayer dielectric layer above a substrate where a photodiode is formed;
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