Interconnect geometric variation extraction is a key factor for the integrated circuit design for manufacturability research and development, under ultra deep sub-micro process nodes.
硅片上互连线几何变异提取对于超深亚微米工艺节点下集成电路可制造性设计研究开发极其关键。
Motion control system of an ultra precision wafer stage with application to integrated circuit production was presented.
描述一种应用于集成电路制造的超精密硅片台系统及其运动控制。
Mini ultra small form-factor, simple structure, and practical, suitable for thin-film PV modules, widely used in the field of building integrated solar PV.
袖珍型超小外形，结构简洁实用，适用于薄膜光伏组件，广泛使用于太阳能光电建筑一体化领域。
A cascode operational transconductance amplifier (OTA) is designed, which was integrated into an ultra-low power LDO regulator chip.
设计了一个共源共栅运算跨导放大器，并成功地将其应用在一款超低功耗ld O线性稳压器芯片中。
Mini ultra-small form factor, simple structure, and practical, applicable to crystalline silicon PV modules are widely used in the field of building integrated solar PV.
袖珍型超小外形，结构简洁实用，适用于晶硅光伏组件，广泛使用于太阳能光电建筑一体化领域。
These highly integrated modules are ultra-compact and easy to use, and provide a wide range of customization and scalability options.
这些高度集成模块是超小型，易于使用，并提供了广泛的定制和可扩展性的选项。
The MSP430 series monolithic integrated circuit is a kind of 16 bits ultra low power and composite signal processor which ti Corporationpromotes.
MSP430系列单片机是TI公司推出的一种16位超低功耗和混合信号处理器。
As the integrated circuit design has stepped into the deep ultra-submicron stage, the complexity of the circuit increases continually, chip test faces very huge challenge.
随着集成电路设计进入超深亚微米阶段，电路复杂度不断提高，芯片测试面临着巨大的挑战。
As the integrated circuit design has stepped into the deep ultra-submicron stage, the complexity of the circuit increases continually, chip test faces very huge challenge.
随着集成电路设计进入超深亚微米阶段，电路复杂度不断提高，芯片测试面临着巨大的挑战。
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