In the process of thermal bonding, experiments are carried out under different conditions such as variable polymer thick, temperature, channel width and time.
在对微纳米通道进行热键合过程中，分别改变键合胶层厚度，键合温度，通道尺寸和键合时间四个条件进行了实验。
In the process of thermal bonding, experiments are carried out under different conditions such as variable polymer thick, temperature, channel width and time.
在对微纳米通道进行热键合过程中，分别改变键合胶层厚度，键合温度，通道尺寸和键合时间四个条件进行了实验。
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