In order to predict failure location of BGA lead-free solder joints under a drop impact, ABAQUS software is used to analysis stress distribution of the solder joints.
为了预测跌落碰撞下球栅阵列(BGA)封装中无铅焊点的失效,采用ABAQUS软件来模拟跌落碰撞过程中焊点的应力分布。
Based on analysis of data from a domestic Internet forum, it is found that the degree distribution of this network is a power law distribution and has the scale-free characteristic.
本文通过对我国某网络论坛数据进行分析处理,发现该网络的度分布为幂律分布,有明显的无标度特征。
Based on analysis of data from a domestic Internet forum, it is found that the degree distribution of this network is a power law distribution and has the scale-free characteristic.
本文通过对我国某网络论坛数据进行分析处理,发现该网络的度分布为幂律分布,有明显的无标度特征。
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