封装寄生效应对高频器件性能的影响越来越明显。

Parasitic effects of packaging have significant effect on performance of rf ICs.

youdao

随着集成电路设计复杂性以及电路工作时钟频率的不断提高，互连与封装等寄生效应对电路的影响越来越大，产生了信号完整性问题。

At very high frequencies, interconnects and packages can only be characterized by a set of sampled data from measurements or electromagnetic simulations over the frequency of interests.

youdao

随着集成电路设计复杂性以及电路工作时钟频率的不断提高，互连与封装等寄生效应对电路的影响越来越大，产生了信号完整性问题。

At very high frequencies, interconnects and packages can only be characterized by a set of sampled data from measurements or electromagnetic simulations over the frequency of interests.

youdao