The Endura platform is a modular, configurable system used to deposit metals and metal alloys on the wafer.
Endura平台是一种模块化的可配置系统，用来在晶圆上沉积金属和金属合金。
Average wafer thickness value on basis of 100% control with an automatic inspection system.
晶片的平均厚度值以100%控制的自动检测系统的测量值为基础。
This pneumatic servo load system can satisfy the needs of double-sided polishing machine, which can successfully produce the ultra-smooth and flat surface on both sides of silicon wafer.
结果表明气动伺服加载系统能满足双面抛光的要求，可以加工出双面超平滑的硅片。
Image quality is the key performance of the optical lithography tool and it relies on the performance of wafer focusing and leveling measurement system.
成像质量是光学光刻机的最主要指标，硅片调焦调平测量是光刻机控制成像质量的基础。
MMIC on-wafer probe is the key part of MMIC on-wafer measurement system.
MMIC在片测试探头是MMIC在片测试系统的关键部件。
MMIC on-wafer probe is the key part of MMIC on-wafer measurement system.
MMIC在片测试探头是MMIC在片测试系统的关键部件。
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