The source material for a sputtering process.
溅射工艺用源材料。
Its approach is to deposit the CIGS layer using a sputtering process borrowed from the disk-storage industry.
它的方法是通过借鉴于碟片储存行业的“喷溅”处理来沉积CIGS层面。
The results show that the sputtering process factors have large effect on the compositions and magnetic properties.
结果表明，溅射工艺因素对薄膜的成份和磁性能有较大的影响。
However, it is still a question how to determine sputtering process parameters, microstructure and properties of thin films.
然而溅射工艺参数的选取以及沉积的薄膜结构和性能是人们主要关注的课题。
The paper has outlined the dispersion technology, sticking method and sputtering process for powder specimen studied by using SEM.
阐述了用扫描电镜研究粉末试样的分散技术、固定方法和镀膜技术。
Magnetron sputtering process has widely been applied to thin film preparation, during which, the quality of thin film is affected badly by the current stability of target.
磁控溅射技术在薄膜制备领域的应用十分广泛，而溅射靶电流的稳定性极大的影响溅射镀膜的膜层质量。
The utility model may be manufactured only by a common sputtering process and therefore enjoys a low production cost, which is beneficial to the mass production and popularization of the product.
采用通常的减射工艺即可完成且生产成本低，便于产品的规模化生产及推广。
The transverse component of magnetic flux intensity is pivotal that affect the utilization rate of target material and quality of deposition film as well as the instability of the sputtering process.
利用有限元理论对靶表面磁通量密度的横向分量进行了模拟分析。
Some basic law and characteristics of laser sputtering and film growth process, revealed by a lot of experiment studies are described in detail.
重点阐述了近年来由大量实验研究所揭示出的激光溅射及成膜过程的一些基本特点和规律。
With the view of the application in factory, the process of tin decorative coating coated by magnetron sputtering coater is emphatically discussed in this paper.
本文从工厂应用的角度着重讨论磁控溅射镀膜机镀氮化钛装饰膜的工艺问题。
Three pole reaction sputtering has the properties of simple equipment, easy process and fined film.
三极反应溅射具有设备简单，工艺简便，镀层致密等特点。
The micromachining process like photolithograph, electroplate and sputtering etc is adopted to fabricate the stator of MGELR.
采用了光刻、电镀、溅射等微细加工工艺制造了MGELR的定子。
However, the predominant process of secondary ion sputtering is kinetic sputtering, which closely related to the momentum deposition on the target surface (nuclear stopping power).
而主导二次离子溅射的过程是动能溅射，它与靶表面的动量沉积(核能损)过程密切相关。
The gate region was fabricated by V-groove and Al sputtering, which can simplify the process, and make devices flexible in the adjustment process.
使用V形槽工艺，用溅射铝的方法代替扩硼工艺制备静电感应晶体管的栅极区，简化了工艺流程，使器件在调试过程中具有很大灵活性。
Compared with the pollution of the traditional plating or spray coating method to the environment, the vacuum sputtering is environmental process and accords with ROHS standard completely.
相对于传统水电镀或喷涂方式对环境的污染，真空溅射是环保制程，完全符合ROHS标准。
The technology of magnetron sputtering is an important method of preparing new materials in modern times, especially in the process of preparation of films.
磁控溅射技术是现代材料制备的重要方法之一，特别是在薄膜的制备过程中显得更为重要。
Using X-ray diffraction technique, the process of the crystal growth of metal ultrafine particles, which are prepared by sputtering method and deposited on the silica! Substrate, have been researched.
利用X -射线衍射技术对溅射沉积在非晶二氧化硅基底上的金属晶体超微粒的生长特性进行实验研究。
The kinetic process of reactive magnetron sputtering has been studied.
研究了反应磁控溅射的动力学过程。
The back ohmic contact resistance of Al-BSF by DC magnetron sputtering is downtrend with the annealing temperature increasing, and less than that by the screen printing process.
溅射工艺制备出的铝背场接触电阻随退火温度升高呈下降趋势且溅射工艺的接触电阻比印刷工艺更小。
This paper deals with the question of the sputtering and permeating mechanism on double glow discharge surface alloying process. Four permeating models are put forward.
本文从理论上分析了双层辉光离子渗金属的溅射问题及渗入机理，提出了四种渗入模型。
The application and features of vaccum strip coating processes such a thermal jet evaporation, magnetron sputtering, electron-beam evaporation and plasma enhanced EB evaporation process were reviewed.
介绍了新一代连续带钢镀膜技术-真空镀膜的工艺特点及应用现状。
Aluminum film on uranium is prepared using magnetron sputtering with and without circulated argon ion bombardment process.
以磁控溅射沉积方法，采用循环氩离子轰击镀和未循环轰击镀工艺在金属铀上制备了铝薄膜。
It is a sophisticated process, performed under vacuum which deposits microscopic particles on the products by ion bombing or sputtering, to form a protecting coating on their surface.
这是一个复杂的过程，在充满微粒子的真空环境下对产品进行离子溅镀，以在产品表面形成保护层。
Disclosed is a sputtering film-forming apparatus which is capable of forming a metal compound film with good characteristics at higher film-forming rate by a simple process at low cost.
提供能够以更快的成膜速度形成具有良好特性的金属化合物膜，并且能够简单地、低成本地构成的溅射成膜装置。
We employ the magnetic sputtering method to deposit amorphous tungsten films and investigate their thermal annealing process.
对使用磁控溅射法沉积的钨薄膜进行了热退火研究。
In the process of manufacturing Ni-Cr alloy filmresistances of IC by using magnetronic sputtering, the film resistive property has been found having a regular change after annealing process.
这一现象的发现对我们今后在集成电路镍铬合金薄膜电阻的设计优化方面具有较高的参考意义。
During deposition process, the temperature of target increases for the bad cooling condition which increase the sputtering rate, so the metallic state sputtering is formed.
分析认为，在大电流、散热不良的情况下，靶面温度升高会极大增高靶材的被溅蚀速率，从而呈现金属态沉积。
During deposition process, the temperature of target increases for the bad cooling condition which increase the sputtering rate, so the metallic state sputtering is formed.
分析认为，在大电流、散热不良的情况下，靶面温度升高会极大增高靶材的被溅蚀速率，从而呈现金属态沉积。
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