The utility model discloses a multi-chip packaging structure comprising at least a loader, at least a packaging module, an insulation layer and a pattern metal layer.
本实用新型公开一种多芯片封装结构，至少包括一承载器、至少一封装模块、一绝缘层及一图案化金属层。
The pattern metal layer is arranged on the insulation layer and filled into the diversion holes, thereby being an inner linking layer of the multi-chip packaging structure of the utility model.
图案化金属层位于绝缘层上并填入于导通孔中，以作为本实用新型多芯片封装结构的内连线层。
The pattern metal layer is arranged on the insulation layer and filled into the diversion holes, thereby being an inner linking layer of the multi-chip packaging structure of the utility model.
图案化金属层位于绝缘层上并填入于导通孔中，以作为本实用新型多芯片封装结构的内连线层。
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