• Flip Chip on Board (FCOB) has been used widely as a microelectronics packaging structural form.

    倒装芯片(FCOB)作为一种微电子封装结构形式得到广泛的应用。

    youdao

  • Flip Chip on Board (FCOB) has been used widely as a microelectronics packaging structural form.

    倒装芯片(FCOB)作为一种微电子封装结构形式得到广泛的应用。

    youdao

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