Furthermore, the effect of solder ball layout and stress relax buffer layer material on the fatigue life of solder joints is studied.
最后探测锡球配置方式和缓冲层材料性质对于锡球疲劳寿命的影响，以获得高可靠度的封装结构。
Furthermore, the effect of solder ball layout and stress relax buffer layer material on the fatigue life of solder joints is studied.
最后探测锡球配置方式和缓冲层材料性质对于锡球疲劳寿命的影响，以获得高可靠度的封装结构。
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