The chip taking-putting head can take a chip on a wafer and selectively position the chip on the first material tray or the second material tray according to the chip grade.
所述的芯片取放头可在一晶圆上取一芯片并根据所述的芯片等级而选择放置在所述的第一料盘或者所述的第二料盘上。
The chip taking-putting head can take a chip on a wafer and selectively position the chip on the first material tray or the second material tray according to the chip grade.
所述的芯片取放头可在一晶圆上取一芯片并根据所述的芯片等级而选择放置在所述的第一料盘或者所述的第二料盘上。
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