A further 10 fold improvment in rinsing efficiency per rinse cycle can be achieved by spinning the wafer and using centrifugal force to remove a greater fraction of the stagnant layer (1).
通过旋转晶片，并利用离心力去除更大部分的停滞层，每个清洗循环可将清洗效率再提高10倍眼1演。
A further 10 fold improvment in rinsing efficiency per rinse cycle can be achieved by spinning the wafer and using centrifugal force to remove a greater fraction of the stagnant layer (1).
通过旋转晶片，并利用离心力去除更大部分的停滞层，每个清洗循环可将清洗效率再提高10倍眼1演。
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