Set up ultrasonic wire bonding laboratory.
成立超声波电子焊接实验室。
In ultrasonic wire bonding process, the bonding pressure is one of the most important factors to the bonding strength.
在超声引线键合过程中，键合力是影响键合强度的重要因素之一。
Thermal-structural analysis was performed for ultrasonic wire bonding(UWB) by three dimensional finite element method(FEM).
用三维有限元方法对超声波线焊进行了瞬态的热-结构分析。
According to the circuit of ultrasonic wire bonding experiment platform, a piezoelectric transducer (PZT) driver signal acquisition circuit was designed.
根据超声引线键合实验平台电路结构，设计了PZT(压电陶瓷)驱动信号采集电路。
Aluminum wire ultrasonic bonding; transducer drive current; signal time-frequency analysis; feature selecting; quality online monitoring.
粗铝丝超声引线键合；换能器驱动电流；信号时频分析；特征提取；质量在线监测。
The effect of bonding time on the bonding strength of thick aluminum wire wedge bonding was studied under different ultrasonic power conditions.
试验研究了不同超声功率条件下，键合时间对粗铝丝引线键合强度的影响规律。
The influences of ultrasonic power on heavy aluminum wire wedge bonding strength were investigated.
超声功率是影响粗铝丝引线键合强度的最主要因素之一。
This paper simply described the process inspection of automation Al wire ultrasonic wedge bonding in ceramic packaging IC.
本文简要描述了陶瓷外壳封装集成电路自动铝丝楔焊键合的工序检查。
This paper simply described the process inspection of automation Al wire ultrasonic wedge bonding in ceramic packaging IC.
本文简要描述了陶瓷外壳封装集成电路自动铝丝楔焊键合的工序检查。
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